Process window

Case C-0412. The power and pulse map is a mock pending the thermal model; the console runs R23 over T_process and ramp with the engine, which finds the stack feasible up to 1 600 K and the Cr barrier breached in 8.9 µs at the pulse peak (R13).

Feasible window

mock map, bed preheat 180 °C, spot 80 µm

Limits

each traces to a rule

Id	Limit	Rule
L1	Melt pool reaches IN718 solidus at the seed power x pulse >= 2.9 mJ	R03
L2	Interface temperature below 1 300 °C power <= 82 W at 110 µs	R23
L3	Cr barrier survives 5 pulses, P >= 0.9 pulse <= 110 µs, preheat <= 200 °C	R13
L4	Sapphire thermal shock, 0.24 GPa compression dT / dt <= 4.5e5 K / s	R04

Recommended parameters

process sheet

Parameter	Value	Unit	Band
Laser power	60	W	50 to 82
Pulse length	80	µs	50 to 110
Spot diameter	80	µm	70 to 100
Bed preheat	180	°C	150 to 200
Hatch spacing	60	µm	50 to 70
Pulses per site	3	-	1 to 5

ASME IX QW-403 preheatAS9100 process sheet wordingISO / ASTM 52904 build parameters